Device Parameter | Value feedback* | |
Manufacturer Name | Infineon | |
Manufacturer Package | TO262 (Through Hole, 3 Pins, Thermalpad: Bottom WxL: 10.00 x 10.25mm2) |
|
Configuration | Single | |
Channel | N-Type | |
Material | Silicon | |
BVDSS [V] | 55 | |
RDS(ON) typ, max [Ω] | na, 0.035 At VGS = 10V, TA = 25°C |
|
ID max [A] | 30 | |
PD max [W] | 68 | |
QGS typ, max [nC] | na, 5.2 | |
QGD typ, max [nC] | na, 14 | |
QG Total typ, max [nC] | na, 25 | |
RthJA max [C/W] | 40 | |
RthJC max [C/W] | 2.2 | |
DiscoverEE Calculated Values | ||
ID [A] Calc. @RthJA max TJ=175°C, TA=25°C |
6.5 (conservative) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
ID [A] Calc. @ System RthJA = °C/W, TJ=°C, TA=25°C | 13.1 (realistic) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C
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ID [A] Calc. @RthJC max TJ=175°C, TC=25°C |
27.9 (ideal heatsink, Silicon limit) Approx. value as we assume RDS(on)max @ 175 °C = 2.5x RDS(on)max @ 25 °C |
|
PD [W] Calc. @RthJA max TJ=175°C, TA=25°C |
3.8 (conservative) | |
PD [W] Calc. @ System RthJA = 10 °C/W, TJ=175°C, TA=25°C | 15.0 (realistic) | |
PD [W] Calc. @RthJC max TJ=175°C, TC=25°C |
68.2 (ideal heatsink) |
BVDSS [V] | Package | RDS(ON) max [Ω] | VTH [V] | ID [A] | PD [W] | QG Total [nC] | QGS [nC] | QGD [nC] |
60 | Through Hole WxL: 9.84 x 10.16mm2 # of Pins: 3 Thermalpad: Bottom |
0.023 | 2, 4 | 48 | 110 | 60 | 13 | 23 |
55 | Through Hole WxL: 10.00 x 10.10mm2 # of Pins: 3 Thermalpad: Bottom |
0.023 | 2, 4 | 40 | 66 | 35 | 6 | 9 |
55 | Through Hole WxL: 10.00 x 10.10mm2 # of Pins: 3 Thermalpad: Bottom |
0.023 | 1.5, 2.5 | 40 | 66 | 41 | 5 | 8 |
55 | Through Hole WxL: 9.50 x 10.00mm2 # of Pins: 3 Thermalpad: Bottom |
0.023 | 1.5, 2.5 | 40 | 66 | 41 | 5 | 8 |
60 | Through Hole WxL: 10.00 x 10.20mm2 # of Pins: 3 Thermalpad: Bottom |
0.026 | 1.5, 2.5 | 35 | 50 | |||
60 | Through Hole WxL: 10.00 x 10.40mm2 # of Pins: 3 Thermalpad: Bottom |
0.026 | 1.5, 2.5 | 40 | 47 | 30 | 5 | 8 |
60 | Through Hole WxL: 10.00 x 10.20mm2 # of Pins: 3 Thermalpad: Bottom |
0.034 | 1.5, 2.5 | 25 | 50 | |||
55 | Through Hole WxL: 9.84 x 10.16mm2 # of Pins: 3 Thermalpad: Bottom |
0.04 | 2, 4 | 29 | 68 | 34 | 6.8 | 14 |
60 | Through Hole WxL: 10.00 x 10.20mm2 # of Pins: 3 Thermalpad: Bottom |
0.043 | 1.4, 2.6 | 20 |